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? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 1 overview kemet power solutions (kps) automotive series stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. the attached lead-frame mechanically isolates the capacitor/s from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. a two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount mlcc devices. providing up to 10 mm of board fex capability, kps series capacitors are environmentally friendly and in compliance with rohs legislation. available in x7r dielectric, these devices are capable of pb-free refow profles and provide lower esr, esl and higher ripple current capability when compared to other dielectric solutions. combined with the stability of an x7r dielectric, kemets kps series devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. capacitance change is limited to 15% from -55c to +125c. kps series automotive grade capacitors meet the demanding automotive electronics council's aecCq200 qualifcation requirements. benefts ? aecCq200 automotive qualifed ? -55c to +125c operating temperature range ? reliable and robust termination system ? eia 1210, 1812, and 2220 case sizes ? dc voltage ratings of 10 v, 16 v, 25 v, 50 v, 100 v, and 250 v ? capacitance offerings ranging from 0.1 f up to 47 f ? available capacitance tolerances of 10% and 20% ? higher capacitance in the same footprint surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade) ordering information c 2220 c 106 m 5 r 2 c auto ceramic case size (l" x w") specifcation/ series capacitance code (pf) capacitance tolerance 1 voltage dielectric failure rate/design leadframe finish 2 packaging/grade (c-spec) 3 1210 1812 2220 c = standard 2 signifcant digits + number of zeros k = 10% m = 20% 8 = 10 v 4 = 16 v 3 = 25 v 5 = 50 v 1 = 100 v a = 250 v r = x7r 1 = kps single chip stack 2 = kps double chip stack c = 100% matte sn auto = automotive grade 7 reel unmarked auto 7289 = automotive grade 13"reel unmarked 1 double chip stacks ("2" in the 13th character position of the ordering code) are only available in m (20%) capacitance tolerance. single chip stacks ("1" in the 13th character position of the ordering code) are available in k (10%) or m (20%) tolerances. 2 additional leadframe fnish options may be available. contact kemet for details. 3 additional reeling or packaging options may be available. contact kemet for details. one world. one kemet
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 2 2 dimensions C millimeters (inches) top view profile view single or double chip stack double chip stack single chip stack l l h h w lw lw number of chips eia size code metric size code l length w width h height lw lead width mounting technique single 1210 3225 3.50 (.138) 0.30 (.012) 2.60 (.102) 0.30 (.012) 3.35 (.132) 0.10 (.004) 0.80 (.032) 0.15 (.006) solder refow only 1812 4532 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.50 (.020) 2.65 (.104) 0.35 (.014) 1.10 (.043) 0.30 (.012) 2220 5650 6.00 (.236) 0.50 (.020) 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.30 (.012) 1.60 (.063) 0.30 (.012) double 1210 3225 3.50 (.138) 0.30 (.012) 2.60 (.102) 0.30 (.012) 6.15 (.242) 0.15 (.006) 0.80 (.031) 0.15 (.006) 1812 4532 5.00 (.197) 0.50 (.020) 3.50 (.138) 0.50 (.020) 5.00 (.197) 0.50 (.020) 1.10 (.043) 0.30 (.012) 2220 5650 6.00 (.236) 0.50 (.020) 5.00 (.197) 0.50 (.020) 5.00 (.197) 0.50 (.020) 1.60 (.063) 0.30 (.012) benefts cont'd ? potential board space savings ? advanced protection against thermal and mechanical stress ? provides up to 10 mm of board fex capability ? reduces audible, microphonic noise ? extremely low esr and esl ? lead (pb)-free, rohs and reach compliant ? capable of pb-free refow profles ? non-polar device, minimizing installation concerns ? tantalum and electrolytic alternative applications typical applications include smoothing circuits, dc/dc converters, power supplies (input/output flters), noise reduction (piezoelectric/ mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board fexure or temperature cycling. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 3 3 qualifcation/certifcation automotive grade products meet or exceed the requirements outlined by the automotive electronics council. details regarding test methods and conditions are referenced in document aecCq200, stress test qualifcation for passive components. for additional information regarding the automotive electronics council and aecCq200, please visit their website at www.aecouncil.com. environmental compliance lead (pb)-free, rohs, and reach compliant without exemptions (excluding snpb termination fnish option). electrical parameters/characteristics item parameters/characteristics operating temperature range -55c to +125c capacitance change with reference to +25c and 0 vdc applied (tcc) 15% aging rate (maximum % capacitance loss/decade hour) 3.0% dielectric withstanding voltage (dwv) 250% of rated voltage (5 1 seconds and charge/discharge not exceeding 50 ma) dissipation factor (df) maximum limit @ 25oc 5% (6.3 and 10 v), 3.5% (16 and 25 v) and 2.5% (50 to 250 v) insulation resistance (ir) limit @ 25c see insulation resistance limit table (rated voltage applied for 120 5 seconds @ 25c) regarding aging rate: capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours. to obtain ir limit, divide m-f value by the capacitance and compare to g limit. select the lower of the two limits. capacitance and dissipation factor (df) measured under the following conditions: 1 khz 50 hz and 1.0 0.2 vrms if capacitance 10 f 120 hz 10 hz and 0.5 0.1 vrms if capacitance > 10 f note: when measuring capacitance it is important to ensure the set voltage level is held constant. the hp4284 and agilent e4980 have a feature known as automatic level control (alc). the alc feature should be switched to "on." post environmental limits high temperature life, biased humidity, moisture resistance dielectric rated dc voltage capacitance value dissipation factor (maximum %) capacitance shift insulation resistance x7r > 25 all 3.0 20% 10% of initial limit 16/25 5.0 < 16 7.5 surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 4 4 insulation resistance limit table eia case size 1,000 megohm microfarads or 100 g 500 megohm microfarads or 10 g 1210 < 0.39 f 0.39 f 1812 < 2.2 f 2.2 f 2220 < 10 f 10 f surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 5 5 esr C 1210, .22 f, 50 v x7r impedance C 1210, .22 f, 50 v x7r impedance C 1812, .10 f, 50 v x7r esr C 1812, .10 f, 50 v x7r z and esr c1210c475m5r1c z and esr c2220c476m3r2c electrical characteristics 0.01 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 esr (ohms) frequency (hz) esr vs. frequency c1210c224k5r2c (2 chip stack) c1210c224k5r1c (1 chip stack) 0.01 0.1 1 10 100 1000 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 impedance (ohms) frequency (hz) impedance vs. frequency c1210c224k5r2c (2 chip stack) c1210c224k5r1c (1 chip stack) 0.01 0.1 1 10 100 1000 10000 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 impedance (ohms) frequency (hz) impedance vs. frequency c1812c104k5r2c (2 chip stack) c1812c104k5r1c (1 chip stack) 0.01 0.1 1 10 1.e+03 1.e+04 1.e+05 1.e+06 1.e+07 1.e+08 esr (ohms) frequency (hz) esr vs. frequency c1812c104k5r2c (2 chip stack) c1812c104k5r1c (1 chip stack) 10 0 10 2 10 4 esr z surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade) c1210c475m5r1c z and esr frequency (hz) magnitude ohms 10 0 10 2 10 4 10 6 10 8 10 10 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 esr z frequency (hz) magnitude ohms 10 0 10 2 10 4 10 6 10 8 10 10 10 -6 10 -4 10 -2
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 6 6 electrical characteristics cont'd competitive comparision ripple current (arms) 2220, 22 f, 50 v microphonics C 1210, 4.7 f, 50 v, x7r microphonics C 1210, 22 f, 25 v, x7r microphonics C 2220, 47 f, 25 v, x7r microphonics C 1210, 4.7 f, 50 v, x7r microphonics C 2220, 22 f, 50 v, x7r 0 20 40 60 80 100 120 0 10 20 30 absolute temperature (c) ripple current (arms) kemet kps, 2220, 22f, 50v rated (2 chip stack) competitor 2220, 22f, 50v rated (2 chip stack) 0 10 20 30 40 50 60 0 5 10 15 sound pressure (db) vp - p competitor kemet - kps 0 10 20 30 40 50 0 2 4 6 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 0 5 10 15 20 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 0 2 4 6 sound pressure (db) vp - p standard smd mlcc kps - 2 chip stack 0 10 20 30 40 50 60 0 5 10 15 sound pressure (db) vp - p standard smd mlcc kps - 1 chip stack note: refer to table 4 for test method. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 7 7 electrical characteristics cont'd board flexure to 10 mm board flexure to 10 mm board flex vs. termination type board flex vs. termination type 1 0 1 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1812 47uf 16v board flexure (mm) 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 2220 22uf 25v ? (47uf kps stacked) board flexure (mm) standard termination kps ? 2 chip stack 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1210 4.7 uf 50v board flexure (mm) 1 0 . 0 9 . 0 8 . 0 7 . 0 6 . 0 5 . 0 4 . 0 3 . 0 2 . 0 1 . 5 1 . 0 9 0 8 0 7 0 6 0 5 0 4 0 3 0 2 0 1 0 p e r c e n t 2 weibull x7r 1210 10 uf ? (22uf kps stacked) board flexure (mm) standard termination kps ? 2 chip stack surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 8 8 table 1 C capacitance range/selection waterfall (1210 C 2220 case sizes) capacitance cap code case size/series c1210c c1812c c2220c voltage code 8 4 3 5 1 a 4 3 5 1 a 4 3 5 1 a rated voltage (vdc) 10 16 25 50 100 250 16 25 50 100 250 16 25 50 100 250 capacitance tolerance product availability and chip thickness codes see table 2 for chip thickness dimensions qsd 0.10 f 104 k m fv fv fv fv fv fv gp gp gp ud ud jp jp jp jp jp 0.22 f 224 k m fv fv fv fv fv gp gp gp ud ud jp jp jp jp jp 0.47 f 474 k m fv fv fv fv fv gp gp gp ud ud jp jp jp 1.0 f 105 k m fv fv fv fv fv gp gp gp ud jp jp jp 2.2 f 225 k m fv fv fv fv gp gp gp jp jp jp ud 3.3 f 335 k m fv fv fv fv gp gp gp jp jp jp ud 4.7 f 475 k m fv fv fv fv gp gp gp jp jp jp 10 f 106 k m fv fv fv gp gp jp jp jp 15 f 156 k m fv jp jp 22 f 226 k m fv jp jp double chip stack 0.10 f 104 m fw fw fw fw fw fw gr gr gr ud ud jr jr jr jr jr 0.22 f 224 m fw fw fw fw fw fw gr gr gr ud ud jr jr jr jr jr 0.47 f 474 m fw fw fw fw fw gr gr gr ud ud jr jr jr jr jr 1.0 f 105 m fw fw fw fw fw gr gr gr ud ud jr jr jr 2.2 f 225 m fw fw fw fw fw gr gr gr ud jr jr jr 3.3 f 335 m fw fw fw fw gr gr gr ud jr jr jr ud 4.7 f 475 m fw fw fw fw gr gr gr jr jr jr 10 f 106 m fw fw fw fw gr gr gr jr jr jr 22 f 226 m fw fw fw gr gr jr jr jr 33 f 336 m fw jr jr 47 f 476 m fw jr jr capacitance cap code rated voltage (vdc) 10 16 25 50 100 250 16 25 50 100 250 16 25 50 100 250 voltage code 8 4 3 5 1 a 4 3 5 1 a 4 3 5 1 a case size/series c1210c c1812c c2220c ud = under development these products are protected under us patent 8,331,078 other patents pending, and any foreign counterparts. table 2 C chip thickness/packaging quantities thickness code case size thickness range (mm) paper quantity plastic quantity 7" reel 13" reel 7" reel 13" reel fv 1210 3.35 0.10 0 0 600 2,000 fw 1210 6.15 0.15 0 0 300 1,000 gp 1812 2.65 0.35 0 0 500 2,000 gr 1812 5.00 0.50 0 0 400 1,700 jp 2220 3.50 0.30 0 0 300 1,300 jr 2220 5.00 0.50 0 0 200 800 thickness code case size thickness range (mm) 7" reel 13" reel 7" reel 13" reel paper quantity plastic quantity package quantity based on fnished chip thickness specifcations. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 9 9 table 3 C kps land pattern design recommendations (mm) eia size code metric size code median (nominal) land protrusion c y 1210 3225 1.50 1.14 1.75 5.05 3.40 1812 4532 2.20 1.35 2.87 6.70 4.50 2220 5650 2.69 2.08 4.78 7.70 6.00 image at right based on an eia 1210 case size. soldering process kemets kps series devices are compatible with ir refow techniques. preheating of these components is recommended to avoid extreme thermal stress. kemet's recommended profle conditions for ir refow refect the profle conditions of the ipc/jCstdC020d standard for moisture sensitivity testing. to prevent degradation of temperature cycling capability, care must be taken to prevent solder from fowing into the inner side of the lead frames (inner side of "j" lead in contact with the circuit board). after soldering, the capacitors should be air cooled to room temperature before further processing. forced air cooling is not recommended. hand soldering should be performed with care due to the diffculty in process control. if performed, care should be taken to avoid contact of the soldering iron to the capacitor body. the iron should be used to heat the solder pad, applying solder between the pad and the lead, until refow occurs. once refow occurs, the iron should be removed immediately. (preheating is required when hand soldering to avoid thermal shock.) profle feature snpb assembly pb-free assembly note: all temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly refow. t i m e t e m p e r a t u r e t s m i n 2 5oc to peak t l t s 2 5 t p t s m a x t l t p m a x imum r a m p u p r a t e = 3oc/seconds m a x imum r a m p d o w n r a t e = 6oc/seconds y c c x x v2 grid placement courtyard y v1 surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 10 10 storage & handling ceramic chip capacitors should be stored in normal working environments. while the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. in addition, packaging materials will be degraded by high temperatureC reels may soften or warp and tape peel force may increase. kemet recommends that maximum storage temperature not exceed 40oc and maximum storage humidity not exceed 70% relative humidity. temperature fuctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. for optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. construction dielectric material (batio 3 ) detailed cross section barrier layer (ni) base metal (cu) inner electrodes (ni) termination finish (sn) barrier layer (ni) base metal (cu) termination finish (sn) inner electrodes (ni) dielectric material (batio 3 ) leadframe attach (high melting point solder) leadframe (phosphor bronze - alloy 510) surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 11 11 product marking laser marking option is not available on: ? c0g, ultra stable x8r and y5v dielectric devices ? eia 0402 case size devices ? eia 0603 case size devices with flexible termination option. ? kps commercial and automotive grade stacked devices. these capacitors are supplied unmarked only. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 12 12 tape & reel packaging information kemet offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with eia standard 481. this packaging system is compatible with all tape-fed automatic pick and place systems. see table 2 for details on reeling quantities for commercial chips. table 4 C carrier tape conf guration C embossed plastic (mm) eia case size tape size (w)* pitch (p 1 )* 01005 C 0402 8 2 0603 C 1210 8 4 1805 C 1808 12 4 1812 12 8 kps 1210 12 8 kps 1812 & 2220 16 12 array 0508 & 0612 8 4 *refer to figure 1 for w and p 1 carrier tape reference locations. *refer to table 5 for tolerance specif cations. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 13 13 figure 1 C embossed (plastic) carrier tape dimensions p o t f w c en t er li n e s of cav i t y a o b o u s e r d i r e c t i o n o f u n r e elin g c ov er t ap e k o b 1 i s f or t ap e f e ed er r e f e r ence onl y, i ncl u di ng dr a ft con c en t r i c a bou t b o . t 2 ? d 1 ? d o b 1 s 1 t 1 e 1 e 2 p 1 p 2 e m b os s m e nt f or c a v i t y s i z e , s e e n o t e 1 t a b l e 4 [ 1 0 p i t c h e s c um u l at i v e t ol er a n c e o n t a p e 0. 2 m m ] 7deoh2(pervvhg3odvwlf&duulhu7dsh'lphqvlrqv metric will govern constant dimensions millimeters (inches) tape size d 0 d 1 minimum note 1 e 1 p 0 p 2 r reference note 2 s 1 minimum note 3 t maximum t 1 maximum 8 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 1.0 (0.039) 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) 25.0 (0.984) 0.600 (0.024) 0.600 (0.024) 0.100 (0.004) 12 mm 1.5 (0.059) 30 (1.181) 16 mm variable dimensions millimeters (inches) tape size pitch b 1 maximum note 4 e 2 minimum f p 1 t 2 maximum w maximum a 0 ,b 0 & k 0 8 mm single (4 mm) 4.35 (0.171) 6.25 (0.246) 3.5 0.05 (0.138 0.002) 4.0 0.10 (0.157 0.004) 2.5 (0.098) 8.3 (0.327) note 5 12 mm single (4 mm) & double (8 mm) 8.2 (0.323) 10.25 (0.404) 5.5 0.05 (0.217 0.002) 8.0 0.10 (0.315 0.004) 4.6 (0.181) 12.3 (0.484) 16 mm triple (12 mm) 12.1 (0.476) 14.25 (0.561) 7.5 0.05 (0.138 0.002) 12.0 0.10 (0.157 0.004) 4.6 (0.181) 16.3 (0.642) 1. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 2. the tape with or without components shall pass around r without damage (see figure 5). 3. if s 1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see eia standard 481 paragraph 4.3 section b). 4. b 1 dimension is a reference dimension for tape feeder clearance only. 5. the cavity def ned by a 0 , b 0 and k 0 shall surround the component with suff cient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see figure 3). (e) for kps series product, a 0 and b 0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see addendum in eia standard 481 for standards relating to more precise taping requirements. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 14 14 packaging information performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 to 1.0 newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia standards 556 and 624 . figure 2 C maximum component rotation a o b o t s maxi m u m c ompone n t r o t a tio n t op v i e w m a x i mum c o mponent r o t a t ion s ide v i e w t a p e m axi m u m width (mm) r otati o n ( t ) 8,12 2 0 16 ? 200 1 0 t a p e m a x i m u m widt h ( mm) r o tati o n ( s ) 8,12 20 16 ? 56 1 0 72 ? 200 5 t y p ic a l p o c k e t cente r line t y p i c a l c o m pon e n t c e n t e r l i n e figure 3 C maximum lateral movement 0 . 5 m m m a x i mum 0 . 5 m m m a x i mum 8 m m & 1 2 m m tape 1 . 0 m m m a x i mum 1 . 0 m m m a x i mum 1 6 m m t a p e figure 4 C bending radius r r b end i n g r a d i u s e mbo ssed c a r r i e r p unc hed c a rrier surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 15 15 figure 5 C reel dimensions a d (see n o te ) full r a d i us, see n o t e b ( s ee note) access h o le at s l o t loc a ti on (? 40 m m mi nimum) i f p r es en t, tape slot i n core for t ape start: 2.5 mm minimum wi dt h x 10.0 mm mi n imum dep th w 3 (incl u des flan g e dis to r tion at out e r e dge) w 2 ( m eas u re d a t hub ) w 1 ( m eas u re d a t hub ) c (arbor hol e di a m e ter ) note: driv e spok es o ptiona l ; if u s ed, d i mensi o ns b an d d shall a pply. n 7deoh25hho'lphqvlrqv metric will govern constant dimensions millimeters (inches) variable dimensions millimeters (inches) surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 16 16 figure 6 C tape leader & trailer dimensions t r a i le r 160 mm min imum c a r r i e r t ape e n d s t a r t r o und s p rocke t h o l e s e l ongated s p r o cke t h o l e s ( 32 mm tape and w i der ) t op c o ver t ape top c over t ape p unched c a r r i e r 8 mm & 12 m m o n l y e mboss ed c a r r i e r c o m p o n e n t s 1 0 0 m m m i n imum leader 4 0 0 mm m i n i m u m figure 7 C maximum camber c a r r i e r t a p e r o u n d s p r o c k e t h ol e s 1 m m max i m u m , e i t h e r d i r e c t i o n s t r ai gh t edge 2 5 0 m m e l o n g a t ed s p r oc k e t h ol e s ( 32 m m & w ide r t a pes ) surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 17 17 kemet corporation world headquarters 2835 kemet way simpsonville, sc 29681 mailing address: p.o. box 5928 greenville, sc 29606 www.kemet.com tel: 864-963-6300 fax: 864-963-6521 corporate off ces fort lauderdale, fl tel: 954-766-2800 north america southeast lake mary, fl tel: 407-855-8886 northeast wilmington, ma tel: 978-658-1663 central novi, mi tel: 248-306-9353 west milpitas, ca tel: 408-433-9950 mexico guadalajara, jalisco tel: 52-33-3123-2141 europe southern europe paris, france tel: 33-1-4646-1006 sasso marconi, italy tel: 39-051-939111 central europe landsberg, germany tel: 49-8191-3350800 kamen, germany tel: 49-2307-438110 northern europe bishops stortford, united kingdom tel: 44-1279-460122 espoo, finland tel: 358-9-5406-5000 asia northeast asia hong kong tel: 852-2305-1168 shenzhen, china tel: 86-755-2518-1306 beijing, china tel: 86-10-5829-1711 shanghai, china tel: 86-21-6447-0707 taipei, taiwan tel: 886-2-27528585 southeast asia singapore tel: 65-6586-1900 penang, malaysia tel: 60-4-6430200 bangalore, india tel: 91-806-53-76817 note: kemet reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. kemet does not assume any responsibility for infringement that might result from the use of kemet capacitors in potential circuit designs. kemet is a registered trademark of kemet electronics corporation. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)
? kemet electronics corporation ? p.o. box 5928 ? greenville, sc 29606 (864) 963-6300 ? www.kemet.com c1021_x7r_kps_auto_smd ? 4/30/2014 18 18 disclaimer all product specif cations, statements, information and data (collectively, the information) in this datasheet are subject to change. the customer is responsible for checking and verifying the extent to which the information contained in this publication is applicable to an order at the time the order is placed. all information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. statements of suitability for certain applications are based on kemet electronics corporations (kemet) knowledge of typical operating conditions for such applications, but are not intended to constitute C and kemet specif cally disclaims C any warranty concerning suitability for a specif c customer application or use. the information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. any technical advice inferred from this information or otherwise provided by kemet with reference to the use of kemets products is given gratis, and kemet assumes no obligation or liability for the advice given or results obtained. although kemet designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. although all productCrelated warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. surface mount multilayer ceramic chip capacitors (smd mlccs) kps series, x7r dielectric, 10 C 250 vdc (automotive grade)

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